★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!
Lecturers
Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University
Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd.
Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation
Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials.
Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki
Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM
Capacity: 30 people. *Registration will close once full. Please apply early.
Participation Fee:
[Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen)
◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price.
*However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free.
*After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).
- Company:AndTech
- Price:10,000 yen-100,000 yen